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Visit The 2023 IOTE Shenzhen Sep 20-22, Our Booth 11B40

author:2023-08-24 08:37:00

2023 International Internet of Thing Exhibition is the largest and most comprehensive IoT expo in Asia. It showcases the whole IoT industry chain, covers perceptual layer, network layer and intelligent application layer of IoT. It exhibits the technologies of RFID, sensor network, short-range communication, financial mobile payment, middle-ware, big data processing, Cloud, real-time locating, and etc. It also shows the IoT solutions and applications in various industries, such as transportation, manufacturing, smart grid, smart home, logistics, anti-counterfeiting, attendance, military, asset management, apparel, library, smart city, environment monitoring.


SILION TECH is excited to announce our participation in the 2023 International Internet of Things Exhibition, which will take place from Sep 20-22, 2023, in Shenzhen, China. We will be showcasing our latest UHF RFID Modules that Powered IMPINJ's Ex10 Reader Chip, and RFID Development Board products at booth number 11B40.


Our UHF RFID Modules and Development Board products are designed to help customers rapidly integrate UHF RFID modules, thereby simplifying the implementation process of their own RFID projects with ease and efficiency. We will be demonstrating how our innovative UHF RFID Modules can enhance the performance of various applications within different industries, such as warehousing, logistics, and retail.


As a leading company in the RFID technology field, SILION TECH is dedicated to providing our clients with reliable and cost-effective integrated RFID technology solutions. Our goal is to help clients maximize the efficiency and effectiveness of their RFID projects.


We're looking forward to connecting with like-minded industry professionals at the 2023 International Internet of Things Exhibition in Shenzhen. Please visit our booth at 11B40 to explore our extensive product line and learn more about how SILION TECH can help you realize your RFID project objectives.